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Document Number: 321461-001

Intel® Xeon® Processor 3500 Series

Thermal / Mechanical Design Guide

March 2009

2 Thermal and Mechanical Design Guide

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Intel® Xeon® Processor 3500 Series and LGA1366 socket may contain design defects or errors known as errata which may

cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, the Intel logo, Intel, Pentium, Core and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.

* Other brands and names may be claimed as the property of others.

Thermal and Mechanical Design Guide 3

Contents

1 Introduction ..............................................................................................................7

1.1 References .........................................................................................................8

1.2 Definition of Terms ..............................................................................................8

2 LGA1366 Socket ...................................................................................................... 11

2.1 Board Layout .................................................................................................... 13

2.2 Attachment to Motherboard ................................................................................ 14

2.3 Socket Components........................................................................................... 14

2.3.1 Socket Body Housing .............................................................................. 14

2.3.2 Solder Balls ........................................................................................... 14

2.3.3 Contacts ............................................................................................... 15

2.3.4 Pick and Place Cover............................................................................... 15

2.4 Package Installation / Removal ........................................................................... 16

2.4.1 Socket Standoffs and Package Seating Plane.............................................. 16

2.5 Durability ......................................................................................................... 17

2.6 Markings .......................................................................................................... 17

2.7 Component Insertion Forces ............................................................................... 17

2.8 Socket Size ...................................................................................................... 17

2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 18

3 Independent Loading Mechanism (ILM)................................................................... 19

3.1 Design Concept................................................................................................. 19

3.1.1 ILM Cover Assembly Design Overview ....................................................... 19

3.1.2 ILM Back Plate Design Overview............................................................... 20

3.2 Assembly of ILM to a Motherboard....................................................................... 20

4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 23

4.1 Component Mass............................................................................................... 23

4.2 Package/Socket Stackup Height .......................................................................... 23

4.3 Socket Maximum Temperature............................................................................23

4.4 Loading Specifications........................................................................................ 24

4.5 Electrical Requirements...................................................................................... 24

4.6 Environmental Requirements .............................................................................. 25

5 Sensor Based Thermal Specification Design Guidance.............................................. 27

5.1 Sensor Based Specification Overview ................................................................... 27

5.2 Sensor Based Thermal Specification..................................................................... 28

5.2.1 TTV Thermal Profile ................................................................................ 28

5.2.2 Specification When DTS value is Greater than TCONTROL ............................ 29

5.3 Thermal Solution Design Process .........................................................................30

5.3.1 Boundary Condition Definition ..................................................................30

5.3.2 Thermal Design and Modelling.................................................................. 31

5.3.3 Thermal Solution Validation ..................................................................... 32

5.4 Fan Speed Control (FSC) Design Process .............................................................. 33

5.4.1 Fan Speed Control Algorithm without TAMBIENT Data ................................. 34

5.4.2 Fan Speed Control Algorithm with TAMBIENT Data...................................... 35

5.5 System Validation ............................................................................................. 36

5.6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL........... 37

6 ATX Reference Thermal Solution.............................................................................. 39

6.1 Operating Environment ...................................................................................... 39

6.2 Heatsink Thermal Solution Assembly.................................................................... 40

6.3 Geometric Envelope for the Intel® Reference ATX Thermal Mechanical Design ........... 41

6.4 Reference Design Components............................................................................ 42

Product specificaties

Merk:	HP
Categorie:	Processor
Model:	Intel Xeon W3550
Processorfamilie:	Intel® Xeon® 3000 reeks
Processormodel:	W3550
Aantal processorkernen:	4
Processor lithografie:	45 nm
Processor socket:	Socket B (LGA 1366)
Systeembus:	4.8 GT/s
Processor operating modes:	64-bit
Processor cache:	8 MB
Thermal Design Power (TDP):	130 W
Processor cache type:	L2
CPU multiplier (bus/core ratio):	23
Component voor:	Server/werkplaats
Basisfrequentie processor:	3.06 GHz
VID Voltage Range:	0.800 - 1.225 V
Box:	Nee
Marktsegment:	Server