HP Intel Xeon E5507 Handleiding

HP Processor Intel Xeon E5507

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Reference Number: 321323-002

Intel® Xeon® Processor 5500/5600

Series

Thermal/Mechanical Design Guide

March 2010

2 Thermal/Mechanical Design Guide

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata

which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,

not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor

numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to

represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not

necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost

Technology performance varies depending on hardware, software and overall system configuration. Check with your PC

manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.

Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.

* Other brands and names may be claimed as the property of others.

Thermal/Mechanical Design Guide 3

Contents

1 Introduction ..............................................................................................................9

1.1 References ....................................................................................................... 10

1.2 Definition of Terms ............................................................................................ 10

2 LGA1366 Socket ...................................................................................................... 13

2.1 Board Layout .................................................................................................... 15

2.2 Attachment to Motherboard ................................................................................ 16

2.3 Socket Components........................................................................................... 16

2.3.1 Socket Body Housing .............................................................................. 16

2.3.2 Solder Balls ........................................................................................... 16

2.3.3 Contacts ............................................................................................... 17

2.3.4 Pick and Place Cover............................................................................... 17

2.4 Package Installation / Removal ........................................................................... 18

2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18

2.5 Durability ......................................................................................................... 19

2.6 Markings .......................................................................................................... 19

2.7 Component Insertion Forces ............................................................................... 19

2.8 Socket Size ...................................................................................................... 19

2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20

3 Independent Loading Mechanism (ILM)................................................................... 21

3.1 Design Concept................................................................................................. 21

3.1.1 ILM Cover Assembly Design Overview ....................................................... 21

3.1.2 ILM Back Plate Design Overview............................................................... 22

3.2 Assembly of ILM to a Motherboard....................................................................... 23

4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27

4.1 Component Mass............................................................................................... 27

4.2 Package/Socket Stackup Height .......................................................................... 27

4.3 Socket Maximum Temperature............................................................................27

4.4 Loading Specifications........................................................................................ 28

4.5 Electrical Requirements...................................................................................... 28

4.6 Environmental Requirements .............................................................................. 29

5 Thermal Solutions ................................................................................................... 31

5.1 Performance Targets.......................................................................................... 31

5.1.1 25.5 mm Tall Heatsink ............................................................................ 32

5.2 Heat Pipe Considerations.................................................................................... 33

5.3 Assembly ......................................................................................................... 34

5.3.1 Thermal Interface Material (TIM) .............................................................. 35

5.4 Structural Considerations ................................................................................... 35

5.5 Thermal Design................................................................................................. 35

5.5.1 Thermal Characterization Parameter .........................................................35

5.5.2 Dual Thermal Profile ............................................................................... 36

5.6 Thermal Features .............................................................................................. 37

5.6.1 Fan Speed Control.................................................................................. 37

5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 38

5.6.3 Intel® Turbo Boost Technology ................................................................ 39

5.7 Thermal Guidance ............................................................................................. 39

5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile ................ 39

5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile.............. 40

5.7.3 Absolute Processor Temperature .............................................................. 40

6 Quality and Reliability Requirements ....................................................................... 41

6.1 Test Conditions ................................................................................................. 41

Product specificaties

Merk:	HP
Categorie:	Processor
Model:	Intel Xeon E5507
Processorfamilie:	Intel® Xeon® 5000 reeks
Processormodel:	E5507
Aantal processorkernen:	4
Processor socket:	Socket B (LGA 1366)
Systeembus:	4.8 GT/s
Processor operating modes:	64-bit
Processor cache:	4 MB
Thermal Design Power (TDP):	80 W
Processor cache type:	L2
Component voor:	Server/werkplaats
Basisfrequentie processor:	2.26 GHz
VID Voltage Range:	0.750 - 1.350 V
Box:	Nee
Marktsegment:	Server