Texas Instruments SN74AVC16T245DGVR Handleiding


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To Seven Other Channels
1DIR
1A1
1B1
1OE
To Seven Other Channels
2DIR
2A1
2B1
2OE
1
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24
36
48
2
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SN74AVC16T245
SCES551E – FEBRUARY 2004 – REVISED NOVEMBER 2015
SN74AVC16T245 16-Bit Dual-Supply Bus Transceiver
with Congurable Level-Shifting / Voltage Translation and Tri-State Outputs
1 Features 3 Description
This 16-bit noninverting bus transceiver uses two
1
Control Inputs VIH/VIL Levels Are Referenced to separate congurable power-supply rails. The
VCCA Voltage SN74AVC16T245 device is optimized to operate with
• VCC Isolation Feature – If Either VCC Input Is at VCCA/VCCB set at 1.4 V to 3.6 V. The device is
GND, Both Ports Are in the High-Impedance State operational with VCCA/VCCB as low as 1.2 V. The A
port is designed to track VCCA. VCCA accepts any
Overvoltage-Tolerant Inputs and Outputs Allow
supply voltage from 1.2 V to 3.6 V. The B port is
Mixed-Voltage-Mode Data Communications designed to track VCCB. VCCB accepts any supply
Fully Congurable Dual-Rail Design Allows Each voltage from 1.2 V to 3.6 V. This allows for universal
Port to Operate Over the Full 1.2 V to 3.6 V low-voltage bidirectional translation between any of
Power-Supply Range the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage
• Io Supports Partial-Power-Down Mode Operation nodes.
I/Os Are 4.6 V Tolerant The SN74AVC16T245 device is designed for
Maximum Data Rates asynchronous communication between data buses.
The device transmits data from the A bus to the B
380 Mbps (1.8 V to 3.3 V Level-Shifting) bus or from the B bus to the A bus, depending on the
200 Mbps (<1.8 V to 3.3 V Level-Shifting) logic level at the direction-control (DIR) input. The
200 Mbps (Level-Shifting to 2.5 V or 1.8 V) output-enable (OE) input can be used to disable the
outputs so the buses eectively are isolated.
150 Mbps (Level-Shifting to 1.5 V)
100 Mbps (Level-Shifting to 1.2 V) The SN74AVC16T245 control pins (1DIR, 2DIR,
1OE, and 2OE) are supplied by VCCA.
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II Device Information(1)
ESD Protection Exceeds JESD 22 PART NUMBER PACKAGE BODY SIZE (NOM)
8000-V Human-Body Model (A114-A) TSSOP (48) 12.50 mm × 6.10 mm
200-V Machine Model (A115-A) TVSOP (48) 9.70 mm × 4.40 mm
SN74AVC16T245
1000-V Charged-Device Model (C101) BGA MICROSTAR 7.00 mm × 4.50 mm
JUNIOR (56)
2 Applications (1) For all available packages, see the orderable addendum at
the end of the data sheet.
Personal Electronics
• Industrial
• Enterprise
• Telecom
Logic Diagram (Positive Logic)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74AVC16T245
SCES551E –FEBRUARY 2004 REVISED NOVEMBER 2015
www.ti.com
Table of Contents
1 Features 9 Detailed Description.................................................................. 1............................................ 13
9.1 Overview ................................................................. 13
2 Applications ........................................................... 1
9.2 Functional Block Diagram ....................................... 13
3 Description ............................................................. 1
9.3 Feature Description................................................. 13
4 Revision History..................................................... 2
9.4 Device Functional Modes........................................ 14
5 Description (continued)......................................... 310 Application and Implementation........................ 15
6 Pin Conguration and Functions ......................... 410.1 Application Information.......................................... 15
7 Specications......................................................... 510.2 Typical Application ............................................... 16
7.1 Absolute Maximum Ratings ...................................... 511 Power Supply Recommendations ..................... 18
7.2 ESD Ratings ............................................................ 512 Layout................................................................... 18
7.3 Recommended Operating Conditions ....................... 6
12.1 Layout Guidelines ................................................. 18
7.4 Thermal Information .................................................. 6
12.2 Layout Example .................................................... 19
7.5 Electrical Characteristics........................................... 7
13 Device and Documentation Support ................. 20
7.6 Switching Characteristics: V
CCA = 1.2 V ................... 8
13.1 Documentation Support ........................................ 20
7.7 Switching Characteristics: V
CCA = 1.5 V ± 0.1 V....... 8
13.2 Community Resources.......................................... 20
7.8 Switching Characteristics: V
CCA = 1.8 V ± 0.15 V .... 8
13.3 Trademarks ........................................................... 20
7.9 Switching Characteristics: V
CCA = 2.5 V ± 0.2 V....... 9
13.4 Electrostatic Discharge Caution ............................ 20
7.10 Switching Characteristics: V
CCA = 3.3 V ± 0.3 V..... 9
13.5 Glossary ................................................................ 20
7.11 Operating Characteristics........................................ 9
14 Mechanical, Packaging, and Orderable
7.12 Typical Characteristics .......................................... 10
Information ........................................................... 20
8 Parameter Measurement Information ................ 12
4 Revision History
NOTE: Page numbers for previous revisions may dier from page numbers in the current version.
Changes from Revision D (February 2015) to Revision E Page
Updated Pin Functions Table. ............................................................................................................................................... 4
Changes from Revision C (August 2005) to Revision D Page
• Added table, section, ,ESD Ratings Feature Description Device Functional Modes Application and Implementation
section, section, section, section, andPower Supply Recommendations Layout Device and Documentation Support
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
2Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: SN74AVC16T245
SN74AVC16T245
www.ti.com
SCES551E – FEBRUARY 2004 – REVISED NOVEMBER 2015
5 Description (continued)
This device is fully specied for partial-power-down applications using Io. The Io circuitry disables the outputs,
preventing damaging current backow through the device when it is powered down.
The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to V CCA through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: SN74AVC16T245


Product specificaties

Merk: Texas Instruments
Categorie: Niet gecategoriseerd
Model: SN74AVC16T245DGVR
Breedte verpakking: 449 mm
Diepte verpakking: 853 mm
Hoogte verpakking: 35 mm
Soort: Logic IC
Type verpakking: TVSOP
Aantal per verpakking: 2000 stuk(s)
Temperatuur bij opslag: -65 - 150 °C
Bedrijfstemperatuur (T-T): -40 - 85 °C
Aantal pinnen: 48

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