Texas Instruments SN65HVD3082EP Handleiding


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SNx5HVD308xE Low-Power RS-485 Transceivers
1 Features
• Meets or exceeds the requirements of the TIA/
EIA-485A standard
• Low quiescent power
– 0.3-mA Active mode
– 1-nA Shutdown mode
• 1/8 Unit load up to 256 nodes on a bus
• Bus-pin ESD protection up to 15 kV
• Industry-standard SN75176 footprint
• Fail-safe receiver (bus open, bus shorted,
bus idle)
• Glitch-free power-up and power-down bus inputs
and outputs
2 Applications
•Energy meter networks
•Motor control
• Power inverters
•Industrial automation
• networksBuilding automation
• applicationsBattery-powered
• Telecommunications equipment
3 Description
The SNx5HVD308xE are half-duplex transceivers
designed for RS-485 data bus networks. Powered
by a 5-V supply, they are fully compliant with TIA/
EIA-485A standard. With controlled transition times,
these devices are suitable for transmitting data over
long twisted-pair cables. The SN65HVD3082E and
SN75HVD3082E are optimized for signaling rates
up to 200 kbps. The SN65HVD3085E is suitable
for data transmission up to 1 Mbps, whereas the
SN65HVD3088E is suitable for applications that
require signaling rates up to
20 Mbps.
These devices are designed to operate with very
low supply current, typically 0.3 mA, exclusive of the
load. When in the inactive-shutdown mode, the supply
current drops to a few nanoamps, which makes these
devices ideal for power-sensitive applications.
The wide common-mode range and high ESD
protection levels of these devices, make them suitable
for demanding applications such as energy meter
networks, electrical inverters, status and command
signals across telecom racks, as well as cabled
chassis interconnects, and industrial automation
networks where noise tolerance is essential. These
devices match the industry-standard footprint of the
SN75176 device. The power-on-reset circuits keep
the outputs in a high-impedance state until the
supply voltage has stabilized. A thermal-shutdown
function protects the device from damage, due to
system fault conditions. The SN75HVD3082E is
characterized for operation from 0°C to 70°C and
SN65HVD308xE is characterized for operation from –
40°C to 85°C air temperature. The D package version
of the SN65HVD3082E has been characterized for
operation from –40°C to 105°C.
Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
SN65HVD3082E
SN65HVD3088E
SOIC (D) (8) 4.90 mm × 3.91 mm
VSSOP (DGK) (8) 3.00 mm × 3.00 mm
PDIP (P) (8) 9.81 mm × 6.35 mm
SN75HVD3082E
SN65HVD3085E
SOIC (D) (8) 4.90 mm × 3.91 mm
VSSOP (DGK) (8) 3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
RTRT
R
A B
R RE DE D
D
R
A B
R RE DE D
D
R
D
R
RE
DE
D
A
B
R
D
R
RE
DE
D
A
B
Simplified Schematic
SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562M – AUGUST 2009 – REVISED FEBRUARY 2022
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................4
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information, SN65HVD308xE....................... 5
6.5 Thermal Information, SNx5HVD3082E....................... 5
6.6 Electrical Characteristics: Driver.................................6
6.7 Electrical Characteristics: Receiver............................ 6
6.8 Electrical Characteristics.............................................7
6.9 Switching Characteristics: Driver................................ 7
6.10 Switching Characteristics..........................................8
6.11 Typical Characteristics.............................................. 9
7 Parameter Measurement Information.......................... 11
8 Detailed Description......................................................15
8.1 Overview...................................................................15
8.2 Functional Block Diagram......................................... 15
8.3 Feature Description...................................................15
8.4 Device Functional Modes..........................................15
9 Application and Implementation.................................. 17
9.1 Application Information............................................. 17
9.2 Typical Application.................................................... 17
10 Power Supply Recommendations..............................21
11 Layout...........................................................................21
11.1 Layout Guidelines................................................... 21
11.2 Layout Example...................................................... 21
11.3 Thermal Considerations for IC Packages............... 22
12 Device and Documentation Support..........................23
12.1 Device Support....................................................... 23
12.2 Related Links.......................................................... 23
12.3 Receiving Notification of Documentation Updates..23
12.4 Support Resources................................................. 23
12.5 Trademarks.............................................................23
12.6 Electrostatic Discharge Caution..............................23
12.7 Glossary..................................................................23
13 Mechanical, Packaging, and Orderable
Information.................................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision L (November 2021) to Revision M (February 2022) Page
• Added storage temperature Tstg to table................................................................Absolute Maximum Ratings 4
• Changed the table................................................................................Thermal Information, SN65HVD308xE 5
Changes from Revision K (July 2021) to Revision L (November 2021) Page
• Deleted : Available in a small MSOP-8 package ...................................................................................Feature 1
• Deleted Available in a Small MSOP-8 Package from the title.............................................................................1
• Changed the ψJT D package value from 78.8 to 8.8 in the ..................Thermal Information, SNx5HVD3082E 5
Changes from Revision J (October 2017) to Revision K (July 2021) Page
• Changed the tables...........................................................................................................Thermal Information 5
Changes from Revision I (September 2016) to Revision J (October 2017) Page
• Changed 3.3 V to 5 V on the VCC pin in .........................................................................................Figure 9-4 19
Changes from Revision H (August 2015) to Revision I (September 2016) Page
• Added text to the "The D package version of the SN65HVD3082E has been characterized for Description,
operation from -40°C to 105°C."......................................................................................................................... 1
• Changed the Operating free-air temperature for SN65HVD3082E (D package) From: MAX = 85°C To: 105°C
in .....................................................................................................................................................Section 6.3 5
SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562M – AUGUST 2009 – REVISED FEBRUARY 2022 www.ti.com
2Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E
Changes from Revision G (May 2009) to Revision H (August 2015) Page
• Added section, table, section, Pin Configuration and Functions ESD Ratings Feature Description Device
Functional Modes Application and Implementation Power Supply Recommendations Layout , section, section,
section, section, and Device and Documentation Support Mechanical, Packaging, and Orderable Information
section ............................................................................................................................................................... 1
• Deleted table ......................................................................................................................Dissipation Ratings 1
• Deleted table .....................................................................................................Package Thermal Information 6
Changes from Revision F (March 2009) to Revision G (May 2009) Page
• Added Graph - Driver Rise and Fall Time vs Temperature ................................................................................9
• Added IDLE Bus to the Table.............................................................................................................Function 15
• Added section.....................................................................................................................Receiver Fail-safe 19
www.ti.com
SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562M – AUGUST 2009 – REVISED FEBRUARY 2022
Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3
Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E


Product specificaties

Merk: Texas Instruments
Categorie: Niet gecategoriseerd
Model: SN65HVD3082EP
Breedte: 10.16 mm
Diepte: 6.6 mm
Hoogte: 4.57 mm
Breedte verpakking: 13.97 mm
Diepte verpakking: 506 mm
Hoogte verpakking: 11.23 mm
Type verpakking: PDIP
Aantal per verpakking: 50 stuk(s)
Temperatuur bij opslag: -65 - 150 °C
Bedrijfstemperatuur (T-T): -40 - 85 °C
Aantal pinnen: 8
Breedte (met pennen): 10.16 mm
Diepte (met pennen): 10.92 mm
Hoogte (met pennen): 8.26 mm

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