Texas Instruments LM3370 Handleiding

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L1:2.2 PH

PGND1

SW1

SGND

V

DD

PGND2

L2:2.2 PH

SW2

SDA

LM3370

V

IN1

V

IN2

C

IN2

4.7 PF

2.7V to 5.5V

C

IN1

4.7 PF

2.7V to 5.5V

FB2

EN2

EN1

FB1

C

OUT1

10 PF

C

OUT2

10 PF

V

OUT2

V

OUT1

SCL

nPOR1

V

IN1

nPOR2

V

IN2

*

* Optional Capacitor

4.7 PF

V

IN1

LM3370

www.ti.com

SNVS406N–NOVEMBER2005–REVISEDMAY2013

LM3370DualSynchronousStep-DownDC-DCConverter

withDynamicVoltageScalingFunction

CheckforSamples:LM3370

1

FEATURES

APPLICATIONS

2

•I

2

C-compatibleinterface

•BasebandProcessors

–V

OUT1

=1Vto2Vin50mVSteps•ApplicationProcessors(Video,Audio)

–V

OUT2

=1.8Vto3.3Vin100mVSteps•I/OPower

–AutomaticPFM/PWMModeSwitchingand•FPGAPowerandCPLD

ForcedPWMModeforLowNoiseOperation

DESCRIPTION

–SpreadSpectrumCapabilityUsingI

2

C

TheLM3370isadualstep-downDC-DCconverter

•600mALoadPerChannel

optimizedforpoweringultra-lowvoltagecircuitsfrom

•2MHzPWMFixedSwitchingFrequency(Typ.)

asingleLi-Ionbatteryandinputrailrangingfrom2.7V

•TheBucksOperate180°Out-of-PhaseTiming

to5.5V.Itprovidestwooutputswith600mAloadper

channel.Theoutputvoltagerangevariesfrom1Vto

OffsetforNoiseandInputSurgeCurrent

3.3VandcanbedynamicallycontrolledusingtheI

2

C-

Abatement

compatibleinterface.Thisdynamicvoltagescaling

•InternalSynchronousRectificationforHigh

functionallowsprocessorstoachievemaximum

Efficiency

performanceatthelowestpowerlevel.TheI

2

C-

•InternalSoftStart

compatibleinterfacecanalsobeusedtocontrolauto

PFM-PWM/PWMmodeselectionandother

•Power-on-ResetFunctionforBothOutputs

performanceenhancingfeatures.

•2.7V≤V

IN

≤5.5V

TheLM3370offerssuperiorfeaturesand

•OperatesfromaSingleLi-IonCellor3Cell

performanceforportablesystemswithcomplex

NiMH/NiCdBatteriesand3.3V/5.5VFixedRails

powermanagementrequirements.Automatic

•2.2µHInductor,4.7µFInputand10µFOutput

intelligentswitchingbetweenPWMlow-noiseand

CapacitorPerChannel

PFMlow-currentmodeoffersimprovedsystem

•16-leadWSONPackage(4mmx5mmx0.8efficiency.Internalsynchronousrectification

enhancestheconverterefficiencywithouttheuseof

mm)

furtherexternaldevices.

•20-BumpDSBGAPackage(3.0mmx2.0mmx

0.6mm)

TypicalApplicationCircuit

1

Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof

TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.

2Alltrademarksarethepropertyoftheirrespectiveowners.

PRODUCTIONDATAinformationiscurrentasofpublicationdate.

Copyright©2005–2013,TexasInstrumentsIncorporated

ProductsconformtospecificationsperthetermsoftheTexas

Instrumentsstandardwarranty.Productionprocessingdoesnot

necessarilyincludetestingofallparameters.

Product specificaties