Microchip IS1871 Handleiding

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BM70/71 & IS1870/71 rmware 2.03 Release Notes Fi– July 22, 20 20

IS1870/71 & BM70/71 Firmware 2.03

Release Notes

1Overview

Firmware version 2.0 is a maintenance release for IS1870, IS1871, BM70, and BM71. Firmware

version 2.0 adds new features/ removes limitations in previous release 1.11. This firmware is made

available on Microchip’s web site for existing IC’s and modules.

1.1Resolved Issues

•Fixed read ADC command problem for temperature detection.

•Fixed Sweyntooth BLE vulnerabilities in LL, SMP and L2CAP layers.

•Fixed disconnection issue with Xiaomi Mi 10 Pro Phone.

•Fixed MPAF OTA update UI fail issue.

•Fixed HID over GATT issue.

•Fixed an issue where pairing fails in Multilink scenario with reason DHKey failure check.

•Fixed Instant Pass Issue for Multilink scenarios (LL_STATUS_ERROR_INSTANT_PASSED/0x28)

•IOP Pairing fail issue with Samsung S8 Verizon variant.

•Write to Flash is enabled for few manual pattern commands like WRITE DEVICE NAME

command (0x08).

•Fixed issue where AutoPattern Mode BM70 outputs manual mode data from UART.

•Fixed an issue where the application always starts passive scan irrespective of whether scan

type is set to passive or active.

•Fixed an issue where the SCAN_RES is displayed as ADV_IND.

•Fixed an issue where ADC return value was shown incorrectly.

•Fixed an issue where connection was getting terminated due to MIC failure in Multilink scenario.

1.2New Features

•BLE Data Length Extension to max 251 bytes.

•Maximum BLE ATT MTU size is 247 bytes

•AFH channel map adjust automatically when BLEDK3 is Central role ed

•Supports LE privacy feature v1.1 (disabled by default in UI settings)

•Enhance data transmission throughput in Auto pattern mode

•Supports following in auto pattern mode

oBLEDK3 v2.0 to be GAP Central role

oIt allows two nearby BLEDK3 v2.0 devices with auto pattern to establish BLE link

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