Microchip CD-MSCSM70XM19 Handleiding

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User Guide

DS00005197A - 1

Introducon

Microchip’s Integrated Actuation Solution is a highly integrated, scalable, reliable, compact, andcost-eective,

easy-to-use solution targeting electric motor drives and solenoids on actuator systems in aviation applications

and designed in accordance with aviation standards. It is designed to be driven with external PWM signals.

Safety

Before touching the device, ensure that you are free of electrostatic charge.

Before commencing the installation:

• Disconnect all external power supply.

• Ensure that external power supply cannot be accidentally restarted.

• Deviations of the input voltage from the rated value must not exceed the tolerance limits given in the

specications, otherwise this may cause malfunction and dangerous operation.

• Never touch live parts or cable connections.

Warning

THE DEVICE SHOULD BE INSTALLED BY QUALIFIED PERSONNEL ONLY.

DO NOT INSTALL THE UNIT IF THE UNIT IS VISIBLY DAMAGED.

CARRY OUT WIRING WORK ONLY IF THE UNIT AND CABLES ARE DE-ENERGIZED.

CARRY OUT WIRING WORK ONLY AFTER THE UNIT HAS BEEN CORRECTLY MOUNTED AND SECURED.

DO NOT PERFORM ANY MODIFICATIONS WHEN THE UNIT IS CONNECTED TO A POWER SUPPLY

TERMINALS J1 TO J13 ARE LIVE WHEN THEY ARE CONNECTED TO POWER, EVEN IF THE LOAD IS NOT OPREATING.

CONTACT WITH THIS VOLTAGE IS EXTREMELY DANGEROUS AND MAY CAUSE DEATH OR SEVERE INJURY.

DURING OPERATION THE DEVICE CAN EMIT ELECTROMAGNETIC INTERFERENCE (EMI).

FAILURE TO FOLLOW THESE PRECAUTIONS MAY CAUSE DEATH OR SEVERE INJURY.

Avoiding Electrostac Discharge (ESD)

Any handling of electronic devices must be subject to procedures for protecting electrostatic-sensitivespecic

devices. This unit must be handled accordingly.

In order to ensure a ESD safe environment in which the work on electronics components or subassemblies

such as printed circuit boards are carried out, an ESD Protected Area (ESD PA or EPA) must be set up and

correctly used every time the product is handled or processed. An ESD PA or EPA or is designed to minimize the

generation and retention of ESD which prevents failures when handling and processing the device.

Overall ESD protection is required starting from incoming inspection up to assembly including allnal

intermediate stations in order to avoid possible damage to the units.

The product must not be handled or touched without ESD protection. Neglect of this condition may lead to

product damage or reduced product reliability. Note that the packaging materials used provide reliable ESD

protection.

Integrated User GuideActuaon Soluon

CD-MSCGLQ75X120CTYZBNMG/CD-MSCSM70XM19CTYZBNMG

User Guide

DS00005197A - 2

This user manual gives the main recommendations to appropriately mount Microchip Integrated Actuation

Solution onto the mounting location. Follow the mounting instructions to limit both thermal and mechanical

stresses. Hazard-related notes are also included.

Figure 1. Integrated Actuaon Soluon

CD-MSCGLQ75X120CTYZBNMG/CD-MSCSM70XM19CTYZBNMG

User Guide

DS00005197A - 3

Table of Contents

Introduction...........................................................................................................................................................................1

1. Handling and Storage................................................................................................................................................... 4

2. Integrated Actuation Solution Mounting Instruction................................................................................................5

3. Wire Connection from Connectors..............................................................................................................................8

4. Recommendations for DC-Link Capacitor Connections........................................................................................... 9

4.1. DC-Link PCB Assembly...................................................................................................................................... 9

5. Flammability................................................................................................................................................................ 11

6. Disposal Consideration...............................................................................................................................................12

7. Revision History...........................................................................................................................................................13

Microchip Information....................................................................................................................................................... 14

The Microchip Website............................................................................................................................................... 14

Product Change Service........................................................................................................................ 14Notication

Customer Support.......................................................................................................................................................14

Microchip Devices Code Protection Feature............................................................................................................ 14

Legal Notice..................................................................................................................................................................14

Trademarks.................................................................................................................................................................. 15

Quality Management System.....................................................................................................................................16

Worldwide Sales and Service..................................................................................................................................... 17