Intel Celeron M 360 Handleiding

Intel Processor Celeron M 360

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Document Number: 303110-008

Intel® Celeron® M Processor

on 90 nm Process

Datasheet

January 2007

2 Datasheet

IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for

use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Celeron® M processor may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See www.intel.com/products/processor_number for details.

Intel, Celeron, MMX, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other

countries.

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction ..............................................................................................................7

1.1 Terminology .......................................................................................................8

1.2 References .........................................................................................................8

2 Low Power Features ................................................................................................ 11

2.1 Clock Control and Low Power States .................................................................... 11

2.1.1 Normal State ......................................................................................... 11

2.1.2 AutoHALT Power-Down State ................................................................... 11

2.1.3 Stop-Grant State.................................................................................... 11

2.1.4 HALT/Grant Snoop State ......................................................................... 12

2.1.5 Sleep State ........................................................................................... 12

2.1.6 Deep Sleep State ................................................................................... 13

2.2 FSB Low Power Enhancements............................................................................ 13

2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 14

3 Electrical Specifications ........................................................................................... 15

3.1 Power and Ground Pins ...................................................................................... 15

3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 15

3.2 Voltage Identiﬁcation and Power Sequencing ........................................................ 15

3.3 Catastrophic Thermal Protection .......................................................................... 17

3.4 Signal Terminations and Unused Pins ................................................................... 17

3.5 FSB Frequency Select Signals (BSEL[1:0])............................................................ 17

3.6 FSB Signal Groups............................................................................................. 17

3.7 CMOS Signals ................................................................................................... 19

3.8 Maximum Ratings.............................................................................................. 19

3.9 Processor DC Specifications ................................................................................ 19

4 Package Mechanical Specifications and Pin Information .......................................... 29

4.1 Processor Pinout and Pin List .............................................................................. 37

4.2 Alphabetical Signals Reference ............................................................................ 55

5 Thermal Specifications and Design Considerations .................................................. 63

5.1 Thermal Specifications ....................................................................................... 65

5.1.1 Thermal Diode ....................................................................................... 65

5.1.2 Thermal Diode Offset.............................................................................. 66

5.1.3 Intel® Thermal Monitor........................................................................... 67

Product specificaties

Merk:	Intel
Categorie:	Processor
Model:	Celeron M 360
Productnaam:	Intel Celeron M 360 (1M Cache, 1.40 GHz, 400 MHz FSB)
Type verpakking:	Retaildoos
Processorfamilie:	Intel® Celeron® M
Processormodel:	360
Aantal processorkernen:	1
Processor lithografie:	90 nm
Processor socket:	Socket 478
Systeembus:	- GT/s
Processor aantal threads:	1
Processor operating modes:	32-bit
Processor cache:	1 MB
Tjunction:	100 °C
Bus type:	FSB
Thermal Design Power (TDP):	21 W
Codenaam processor:	Dothan
Processor cache type:	L2
Processorfabrikant:	Intel
Ingebouwde grafische adapter:	Nee
Intel® Hyper Threading Technology (Intel® HT Technology):	Nee
Intel® Turbo Boost Technology:	Nee
Enhanced Intel SpeedStep Technology:	Nee
Execute Disable Bit:	Ja
Idle States:	Nee
Intel® Enhanced Halt State:	Nee
Ingebouwde opties beschikbaar:	Nee
Intel® 64:	Nee
Intel® Virtualization Technology (VT-x):	Nee
Verpakkingsgrootte processor:	35mm x 35mm mm
ARK ID processor:	27143
Intel® Trusted Execution Technology:	Nee
ECC:	Nee
CPU multiplier (bus/core ratio):	14
FSB Parity:	Nee
Front-side bus processor:	400 MHz
Processing die grootte:	87 mm²
Aantal Processing Die Transistors:	144 M
Intel® Demand Based Switching:	Nee
Physical Address Extension (PAE):	32 Bit
Processorserie:	Intel Celeron M 300 Series
Scenario Design Power (SDP):	0 W
Component voor:	Notebook
Type product:	Processor
Code geharmoniseerd systeem (HS):	8473301180
Basisfrequentie processor:	1.4 GHz
VID Voltage Range:	1.004 - 1.292 V
Box:	Ja
Marktsegment:	Mobiel
Compatibele chipsets:	Intel® 852GM
Cache memory:	1 MB
Status:	Discontinued
Processorcache:	1024 KB
Productfamilie:	Legacy Intel Celeron Processor
Laatste wijziging:	63903513
Inclusief koeler:	Ja
Merknaam processor:	Intel® Celeron®
Bandbreedte bus:	400
Type buseenheden:	MHz
Bussnelheid:	400 MHz
Voltage processorkern:	1.260, 1.004-1.292 V
Aantal Graphics & IMC Die Transistors:	144 M