Intel E5450 Handleiding

Intel Processor E5450

Lees hieronder de 📖 handleiding in het Nederlandse voor Intel E5450 (100 pagina's) in de categorie Processor. Deze handleiding was nuttig voor 50 personen en werd door 2 gebruikers gemiddeld met 4.5 sterren beoordeeld

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Reference Number: 318611 Revision: 001

Quad-Core Intel® Xeon® Processor

5400 Series

Thermal/Mechanical Design Guidelines

November 2007

2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Quad-Core Intel® Xeon® 5400 Series may contain design defects or errors known as errata, which may cause the product to

deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling1-800-548-4725, or by visiting Intel's website at http://www.intel.com.

Intel, Intel Inside, Xeon, Intel Core and the Intel logo are trademarks or registered trademarks of Intel Corporation or its

subsidiaries in the United States and other countries.

* Other brands and names may be claimed as the property of others.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3

Contents

1 Introduction ..............................................................................................................9

1.1 Objective ...........................................................................................................9

1.2 Scope ................................................................................................................9

1.3 References .........................................................................................................9

1.4 Definition of Terms ............................................................................................ 10

2 Thermal/Mechanical Reference Design.................................................................... 13

2.1 Mechanical Requirements ................................................................................... 13

2.1.1 Processor Mechanical Parameters ............................................................. 13

2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14

2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18

2.2 Processor Thermal Parameters and Features ......................................................... 19

2.2.1 Thermal Control Circuit and TDP............................................................... 19

2.2.2 Digital Thermal Sensor............................................................................ 20

2.2.3 Platform Environmental Control Interface (PECI) ........................................ 21

2.2.4 Multiple Core Special Considerations ......................................................... 21

2.2.5 Thermal Profile ...................................................................................... 24

2.2.6 TCONTROL Definition .............................................................................. 25

2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®

Processor 5400 Series............................................................................. 26

2.2.8 Performance Targets............................................................................... 28

2.3 Fan Fail Guidelines ............................................................................................ 32

2.4 Characterizing Cooling Solution Performance Requirements..................................... 33

2.4.1 Fan Speed Control .................................................................................. 33

2.4.2 Processor Thermal Characterization Parameter Relationships........................ 34

2.4.3 Chassis Thermal Design Considerations ..................................................... 36

2.5 Thermal/Mechanical Reference Design Considerations ............................................ 37

2.5.1 Heatsink Solutions.................................................................................. 37

2.5.2 Thermal Interface Material....................................................................... 38

2.5.3 Summary .............................................................................................. 38

2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39

2.5.5 Thermal Solution Performance Characteristics ............................................ 41

2.5.6 Thermal Profile Adherence....................................................................... 42

2.5.7 Components Overview ............................................................................ 45

2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®

Xeon® Processor 5400 Series Thermal Profile ............................................ 49

A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 53

A.1 Component Overview......................................................................................... 53

A.2 Thermal Solution Performance Characterics .......................................................... 54

A.3 Thermal Profile Adherence.................................................................................. 54

B Mechanical Drawings ............................................................................................... 57

C Heatsink Clip Load Methodology .............................................................................. 83

C.1 Overview ......................................................................................................... 83

C.2 Test Preparation................................................................................................ 83

C.2.1 Heatsink Preparation .............................................................................. 83

C.2.2 Typical Test Equipment ........................................................................... 86

C.2.3 Test Procedure Examples ........................................................................ 86

C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 86

C.2.5 Preload Degradation under Bake Conditions ............................................... 87

Product specificaties

Merk:	Intel
Categorie:	Processor
Model:	E5450
Productnaam:	Intel Xeon E5450 (12M Cache, 3.00 GHz, 1333 MHz FSB)
Type verpakking:	Retaildoos
Maximale temperatuur (in bedrijf):	67 °C
Processorfamilie:	Intel® Xeon®
Processormodel:	E5450
Aantal processorkernen:	4
Processor lithografie:	45 nm
Processor socket:	LGA 771 (Socket J)
Stepping:	E0
Processor aantal threads:	4
Processor operating modes:	64-bit
Processor cache:	12 MB
Bus type:	FSB
Thermal Design Power (TDP):	80 W
Codenaam processor:	Harpertown
Processor cache type:	L2
Processorfabrikant:	Intel
Intel® Hyper Threading Technology (Intel® HT Technology):	Nee
Intel® Turbo Boost Technology:	Nee
Enhanced Intel SpeedStep Technology:	Ja
Execute Disable Bit:	Ja
Idle States:	Ja
Thermal Monitoring Technologies:	Ja
Intel® Enhanced Halt State:	Ja
Intel® VT-x with Extended Page Tables (EPT):	Nee
Ingebouwde opties beschikbaar:	Nee
Intel® 64:	Ja
Intel® Virtualization Technology (VT-x):	Ja
Verpakkingsgrootte processor:	37.5 x 37.5 mm
ARK ID processor:	33083
Intel® Trusted Execution Technology:	Nee
Processorcode:	SLBBM
Export Control Classification Number (ECCN):	3A991.A.1
CPU multiplier (bus/core ratio):	9
FSB Parity:	Ja
Front-side bus processor:	1333 MHz
Processing die grootte:	214 mm²
Tcase:	67 °C
Aantal Processing Die Transistors:	820 M
Intel® Demand Based Switching:	Ja
Processorserie:	Intel Xeon 5400 Series
Component voor:	Server/werkplaats
Type product:	Processor
Code geharmoniseerd systeem (HS):	8542310001
Systeemtype processor:	DP
Afbeeldingentypetoewijzing:	<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-5.gif" title="Block Diagram" /><img src="https://ark.intel.com/inc/images/diagrams/diagram-6.gif" title="Block Diagram" /></div>
Basisfrequentie processor:	3 GHz
VID Voltage Range:	0.85 - 1.35 V
Commodity Classification Automated Tracking System (CCATS):	NA
Box:	Nee
L2-cache snelheid:	3 GHz
Marktsegment:	Server
Lanceringsdatum:	Q4'07
Cache memory:	12 MB
Status:	Discontinued
Processorcache:	12288 KB
Productfamilie:	Intel Xeon Processor 5000 Sequence
Introductiedatum:	Q4'07
Laatste wijziging:	63903513
Inclusief koeler:	Nee
Merknaam processor:	Intel® Xeon®
Bandbreedte bus:	1333
Type buseenheden:	MHz
Bussnelheid:	1333 MHz
Voltage processorkern:	0.850-1.3500 V
Aantal Graphics & IMC Die Transistors:	820 M