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 2012-2019 Microchip Technology Inc. DS00001876C-page 1

1.0 INTRODUCTION

This application note provides information on general printed circuit board layout considerations for Microchip’s many

families of USB Hub Controller devices. This information is broadly applicable to any of Microchip’s USB 2.0 and USB

3.1 Gen 1 and Gen 2 device implementations.

1.1 Audience

This application note is written for readers that are familiar with PCB design, including signal integrity, differential sig-

naling, and thermal management implementation concepts.

1.2 Objective

The goal of this document is to provide implementation information that specifically applies to designing PCBs using

Microchip’s High Speed and faster families of USB Hub Controller devices. Careful implementation of these guidelines

enables successful designs.

1.3 Overview

Successful operation of Microchip’s USB Hub Controllers requires special consideration for printed circuit board (PCB)

layout. All Microchip USB Hub controllers contain a mix of sensitive analog circuitry, digital core logic, and high speed

I/O circuitry. The PCB’s design is part of the system circuit for all of these subsystems that can either enhance or detract

from desired operation.

General issues such as placement and stack up are covered. Additionally, subsystem issues such as USB 2.0 / 3.1

Gen 1 and Gen 2 signaling/impedance, crystal connections, and other critical circuits are discussed. Controlling EMI,

system power distribution, and signal return path management will also be addressed.

The guidelines presented supersede earlier notes for the applicable devices. The following recommendations are based

on Microchip’s experience and knowledge and may be accepted or rejected. Microchip does not guarantee any design.

Each company is ultimately responsible for determining the suitability of its own design.

1.4 References

•Data Sheets: USB54xx, USB55xx, USB56xx,USB57xx, USB58xx, USB59xx, USB7xxx, USB8xxx, USB38xx,

USB25xx and USB46xx USB Hub Controller and Hub-Combo devices

•Application Note: AN 26.21

•Application Note: AN 18.15

•Evaluation designs that are referenced in this document can be found on the Microchip web site.

AN26.2

Implementation Guidelines for Microchip’s USB 2.0 and

USB 3.1 Gen 1 and Gen 2 Hub and Hub-Combo Devices

Author:Carl Johnson



Microchip Technology Inc.

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