Ibm System x HS23 Handleiding

Ibm Server System x HS23

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IBM Europe, Middle East, and Africa Hardware Announcement

ZG12-0059, dated March 6, 2012

IBM Europe, Middle East, and Africa Hardware

Announcement ZG12-0059

IBM is a registered trademark of International Business Machines Corporation 1

IBM BladeCenter HS23 high-performance blade server

Table of contents

1 9Overview Product number

2Key prerequisites Publications 11

2Planned availability date Technical information 12

3 29Description Pricing

9 29Product positioning Announcement countries

30 Corrections

At a glance

The IBM® BladeCenter® HS23 is a versatile blade server that offers outstanding

performance for virtualization with new levels of memory capacity, CPU

performance, and highly scalable I/O.

Overview

The IBM BladeCenter HS23 offers high performance balanced with flexible, scalable

configuration options and simple management in an efficient server designed to run

a broad range of workloads exceptionally well.

Versatile:

• A feature-rich design enables the HS23 to run a broad range of workloads,

including infrastructure, virtualization, and enterprise applications. This makes it

ideal for cloud computing.

• Integrated 10GbE Virtual Fabric allows for more scalable I/O solutions.

• An extensive choice of processors, memory, internal storage, and I/O options

allows flexible configurations.

• The BladeCenter HS23 is supported in the BladeCenter H chassis (#8852), the

BladeCenter HT chassis (#8740, #8750), the BladeCenter E chassis (#8677),

and the BladeCenter S chassis (#8886). Some configuration limitations apply;

refer to the section.Limitations

Easy to use:

• Simplify deployment of infrastructure for faster time-to-value with IBM

FastSetup.

• Two hot-swap storage bays support SAS and SATA (which includes solid-state)

drives, enabling drives to be removed easily for quick replacement.

• An optional embedded hypervisor helps enable "instant virtualization."

• The Integrated Management Module provides remote supervision and cKVM

functions as standard.

• Light path diagnostics and Predictive Failure Analysis help enable quick

serviceability and maintenance.

Performance optimized:

•Next-generation Intel XeonTM processor E5-2600 product family

• High memory capacity with 16 DDR3 VLP memory DIMM slots supporting 1600

MHz memory and up to 256 GB of DDR3 memory

IBM Europe, Middle East, and Africa Hardware

Announcement ZG12-0059

IBM is a registered trademark of International Business Machines Corporation 2

• High-speed I/O on the blade with integrated 10GbE Virtual Fabric

• Support for running two DIMMs per memory channel at 1600 MHz

• Optional low-power processor, solid-state drives, and low-power memory DIMMs

• Energy-efficient 1.35 volt memory DIMM support

•Support for IBM Systems Director Active Energy ManagerTM to help monitor and

cap power consumption

• Innovative component layout and blade design to help keep the blade up and

running even under demanding conditions

Options included in this Announcement

The IBM BladeCenter GPU Expansion Blade II:

The IBM BladeCenter GPU Expansion Blade II provides the capability to attach next-

generation graphics processing unit (GPU) technology on select server blades. This

offering is ideal for applications requiring high levels of acceleration and visualization

performance. This product ships integrated with the NVIDIA Tesla M2070Q, Tesla

M2075, or Tesla M2090. In addition, the IBM BladeCenter GPU Expansion Blade II

is stackable, allowing clients to stack up to four GPU Expansion Blades on a single

compute blade (support for four GPU Expansion Blade stacking only via specific

machine type for HS22 and only by contacting your IBM Sales Representative),

thereby offering a unique density advantage versus the competition. This GPU

expansion unit is supported only on selected server blades.

The IBM BladeCenter GPU Expansion Blade II:

• Is supported on the IBM BladeCenter HS22 (7870) or HS23 (7875).

• Offers a unique stacking capability that allows users to stack up to four GPU

Expansion Blades on a single HS22 or HS23 server blade. HS22 stacking support

is available for up to four GPU Expansion Blades on a single server blade via

specific HS22 machine type. Contact your IBM Sales Representative for details.

• Provides users with access to the high-speed I/O slot (CFFh) in a stacked

configuration.

• Ships integrated with the NVIDIA Tesla M2090, M2075, or M2070Q.

The Emulex 10GbE Virtual Fabric Adapter II for IBM BladeCenter HS23 (81Y3120)

and Emulex 10GbE Virtual Fabric Adapter Advanced II for IBM BladeCenter HS23

(90Y9332) are new options available to the existing IBM BladeCenter Virtual Fabric

portfolio. These adapters are supported on the new HS23 blade to enable up to

four uplink/downlink ports for increased I/O bandwidth and maximum performance.

The combination of HS23 and Emulex options enables clients to simplify their I/O

infrastructure by reducing the number of switches needed inside the chassis while

supporting Ethernet and Virtual NICs using the same hardware components.

Key prerequisites

• BladeCenter chassis

• Monitor, keyboard, and mouse for setup

• Network switch module

• Boot device, such as on-board HDD or network storage device

• Advanced Management Module with latest-level firmware

• Rack and appropriate PDUs and main power distribution

Planned availability date

• March 16, 2012:

– IBM BladeCenter HS23 Models 91x, 92x, A1x, A2x, B1x, B2x, B3x, C1x, C2x,

C3x, C4x, C5x, D1x, F1x

IBM Europe, Middle East, and Africa Hardware

Announcement ZG12-0059

IBM is a registered trademark of International Business Machines Corporation 3

– IBM BladeCenter Options:

-- Additional Intel Xeon Processor E5-2600 Options

-- 1600MHz VLP RDIMM Options

-- 10Gb Interposer Card for IBM BladeCenter HS23

-- IBM Virtual Fabric Advanced Software Upgrade (LOM)

-- IBM BladeCenter PCI Express® Gen 2 Expansion Blade II

-- IBM BladeCenter GPU Expansion Blade II with NVIDIA Tesla M2070Q

-- IBM BladeCenter GPU Expansion Blade II with NVIDIA Tesla M2075

-- IBM BladeCenter GPU Expansion Blade II with NVIDIA Tesla M2090

• March 30, 2012:

– IBM BladeCenter Options:

-- Emulex 10GbE VFA II for IBM BladeCenter HS23

• June 8, 2012:

– BladeCenter HS23 Models G1x, G2x

– IBM BladeCenter Options:

-- Emulex 10GbE VFA Advanced II for IBM BladeCenter HS23

-- Virtual Fabric Advanced FOD Upgrade for IBM BladeCenter HS23

Description

BladeCenter HS23

High-performance, blade server subsystem

The IBM BladeCenter HS23 blade server is high-throughput, two-way, SMP-capable,

and highly scalable when you add memory and other options.

The BladeCenter HS23 can have up to two Intel Xeon processors. The processor

board has the following major components:

• Two Socket R (LGA2011) sockets for two Intel Xeon E5-2600 processors (two

processors may be shipped standard).

• Sixteen DDR3 VLP DIMM memory sockets.

• One Emulex BladeEngine 3 (BE3) controller with Dual 10Gb + Dual 1Gb Ethernet

and Features On Demand upgrading to FCoE and iSCSI Hardware Offload.

• One LSI 2004 SAS/SATA Controller.

• Two SAS/SATA connectors for two 2.5-inch SAS or SATA storage drives.

• One Renesas SH7757 Super Baseboard Management Controller with Integrated

VGA Controller.

• Two VHDM midplane connectors.

• One CFFh expansion connector.

• One CIOv daughter card connector.

• One TPM 1.2 chip.

• One internal USB connector for bootable Flash key.

The HS23 server memory is contiguous and is shared by both processors when both

processors are installed. It is Error Correction Code (ECC) protected and supports

up to256 GB using 4 GB, 8 GB,or 16 GB VLP DDR3 DIMMs on 16 DIMM connectors.

The processors have integrated DDR3 memory controllers and interface directly to

their eight associated DDR3 DIMMs. For each CPU, a minimum of one DIMM must be

installed. Additional DIMMs may be installed one at a time as needed.

The HS23 supports the Intel Xeon processor E5-2600 product family. For these

processors, memory speed is a specific attribute of the processor. The system

Product specificaties

Merk:	Ibm
Categorie:	Server
Model:	System x HS23
Breedte:	29 mm
Diepte:	446 mm
Hoogte:	245 mm
Stroomvoorziening:	12.2 V DC
Frequentie van processor:	2.6 GHz
Processorfamilie:	Intel® Xeon® E5 familie
Processormodel:	E5-2670
Aantal processorkernen:	8
Ethernet LAN:	Ja
Processor lithografie:	32 nm
Aantal USB 2.0-poorten:	1
VGA (D-Sub)poort(en):	1
Aantal Ethernet LAN (RJ-45)-poorten:	4
Certificering:	GOST, IEC, CE, CISPR
Intern geheugen:	16 GB
Intern geheugentype:	DDR3-SDRAM
Bekabelingstechnologie:	10/100/1000Base-T(X)
Temperatuur bij opslag:	-40 - 70 °C
Relatieve luchtvochtigheid:	8 - 80 procent
Intel® Wireless Display (Intel® WiDi):	Nee
Processor socket:	LGA 2011 (Socket R)
Stepping:	C2
Systeembus:	8 GT/s
Processor aantal threads:	16
PCI Express slots versie:	3.0
Processor operating modes:	64-bit
Processor cache:	20 MB
Bus type:	QPI
PCI Express configuraties:	x4, x8, x16
Thermal Design Power (TDP):	115 W
Codenaam processor:	Sandy Bridge EP
Maximaal aantal PCI Express-lijnen:	40
Processor cache type:	Smart Cache
ECC ondersteund door processor:	Ja
Processorfabrikant:	Intel
Maximum intern geheugen:	256 GB
Totale opslagcapaciteit:	- GB
Soort optische drive:	Nee
Ondersteunde instructie sets:	AVX
Intel® My WiFi Technology (Intel® MWT):	Nee
Intel® Hyper Threading Technology (Intel® HT Technology):	Ja
Intel® Turbo Boost Technology:	2.0
Intel® Quick Sync Video Technology:	Nee
Intel® InTru™ 3D Technology:	Nee
Intel® Clear Video HD Technology (Intel® CVT HD):	Nee
Intel® Insider™:	Nee
Intel® Flex Memory Access:	Nee
Intel® AES New Instructions (Intel® AES-NI):	Ja
Enhanced Intel SpeedStep Technology:	Ja
Execute Disable Bit:	Ja
Idle States:	Ja
Thermal Monitoring Technologies:	Ja
CPU configuratie (max):	2
Intel® Enhanced Halt State:	Ja
Intel® Clear Video Technology for Mobile Internet Devices (Intel® CVT for MID):	Nee
Intel® VT-x with Extended Page Tables (EPT):	Ja
Ingebouwde opties beschikbaar:	Nee
Graphics & IMC lithografie:	32 nm
Intel® Secure Key:	Ja
Intel® 64:	Ja
Intel® Virtualization Technology for Directed I/O (VT-d):	Ja
Intel® Clear Video-technologie:	Nee
Intel® Virtualization Technology (VT-x):	Ja
Verpakkingsgrootte processor:	52.5 x 45.0 mm
Conflictvrije processor:	Nee
Intel® Identity Protection Technology (Intel® IPT):	Nee
Versie Intel® Identity Protection Technology:	0.00
Versie Intel® Secure Key Technology:	1.00
ARK ID processor:	64595
Intel® Trusted Execution Technology:	Ja
Versie Intel® TSX-NI:	0.00
Compatibele besturingssystemen:	Windows Server 2003 R2/2008/2008 R2\r\nWindows HPC Server 2008\r\nWindows Small Business Server 2008\r\nRed Hat EL 5/6\r\nVMware ESXi 4.1/5.0/ESX 4.1
Intel® Anti-Theft Technology (Intel® AT):	Nee
Netwerkfuncties:	10 Gigabit Ethernet
Maximale turbofrequentie van processor:	3.3 GHz
Type behuizing:	Lemmet
Redundante voeding:	Nee
Maximaal intern geheugen ondersteund door processor:	750 GB
Geheugentypen ondersteund door processor:	DDR3-SDRAM
Klokgeheugen-snelheden ondersteund door processor:	800,1066,1333,1600 MHz
ECC:	Ja
Kloksnelheid geheugen:	- MHz
Geheugenlayout:	4 x 4 GB
Geheugenslots:	16x DIMM
Bedrijfstemperatuur, bereik:	50 - 95 °F
Aantal geïnstalleerde processoren:	1
Geheugenbandbreedte ondersteund door de processor ( max):	51.2 GB/s
Schaalbaarheid:	2S
Hoogte, in bedrijf:	-60 - 1800 m
HDD interface:	Serial ATA, Serial Attached SCSI (SAS)
CPU multiplier (bus/core ratio):	33
FSB Parity:	Nee
Front-side bus processor:	- MHz
Tcase:	81.8 °C
Intel® Demand Based Switching:	Ja
Physical Address Extension (PAE):	46 Bit
Geheugenkanalen ondersteund door processor:	Quad
Processorserie:	Intel Xeon E5-2600
Intel® Dual Display Capable Technology:	Nee
Intel® FDI Technology:	Nee
Intel® Rapid Storage Technology:	Nee
Intel® Fast Memory Access:	Nee
HDD omvang:	2.5 "
Maximum aantal HDD's per behuizing:	2
Maximale opslagcapaciteit:	2 TB
aantal QPI links:	2
Maximum geheugen grafische adapter:	16 MB
Max. aantal SMP-processoren:	2
Bedrijfstemperatuur (T-T):	10 - 35 °C
Afbeeldingentypetoewijzing:	<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-18.gif" title="Block Diagram" /></div>
Hot-swap:	Nee