HP ProLiant ML110 Gen9 Handleiding

HP Server ProLiant ML110 Gen9

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HP ProLiant ML110 Gen9 Server

User Guide

Abstract

This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the

servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.

Part Number: 781889- 001

March 2015

Edition: 1

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall

not be liable for technical or editorial errors or omissions contained herein.

Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

Microsoft® and Windows® are U.S. registered trademarks of the Microsoft group of companies.

MicroSD is a trademark or a registered trademark of SD- n the United States, other countries or both. 3C i

Red Hat® is a registered trademark of Red Hat, Inc. in the United States and other countries.

VMware® is a registered trademark of trademark of VMware, Inc. in the United States and/or other jurisdictions.

Contents 3

Contents

Component identification ............................................................................................................... 7

Front panel components ............................................................................................................................. 7

Front panel LEDs and buttons ...................................................................................................................... 8

Front panel LED power fault codes ..................................................................................................... 8

Rear panel components .............................................................................................................................. 9

Rear panel LEDs...................................................................................................................................... 10

System board components ........................................................................................................................ 11

System maintenance switch ............................................................................................................. 12

NMI functionality ........................................................................................................................... 13

DIMM slot locations ....................................................................................................................... 13

F an locations .......................................................................................................................................... 14

Drive numbering ..................................................................................................................................... 14

HP SmartDrive LED definitions ................................................................................................................... 16

Operations ................................................................................................................................. 18

Power up the server ................................................................................................................................. 18

Power down the server ............................................................................................................................. 18

Remove the access panel.......................................................................................................................... 18

Install the access panel............................................................................................................................. 19

Remove the front bezel ............................................................................................................................. 20

Install the front bezel ................................................................................................................................ 21

Remove the PCI air baffle ......................................................................................................................... 22

Install the PCI air baffle ............................................................................................................................ 22

Remove the system air baffle ..................................................................................................................... 23

Install the system air baffle ........................................................................................................................ 24

Setup ......................................................................................................................................... 25

Optional installation services .................................................................................................................... 25

Optimum environment .............................................................................................................................. 25

Space and airflow requirements ...................................................................................................... 25

Temperature requirements ............................................................................................................... 26

Power requirements ....................................................................................................................... 27

Electrical grounding requirements .................................................................................................... 27

Server warnings and cautions ................................................................................................................... 27

Identifying tower server shipping carton contents ......................................................................................... 28

Installing hardware options ....................................................................................................................... 29

Setting up a tower server .......................................................................................................................... 29

Installing the server into a rack .................................................................................................................. 29

Rack warnings ........................................................................................................................................ 30

Installing the operating system................................................................................................................... 31

P owering on and selecting boot options in UEFI Boot Mode.......................................................................... 31

Registering the server ............................................................................................................................... 32

Hardware options installation ....................................................................................................... 33

Introduction ............................................................................................................................................ 33

Drive cage options .................................................................................................................................. 33

4- - bay LFF hot plug drive cage option................................................................................................ 33

Product specificaties

Merk:	HP
Categorie:	Server
Model:	ProLiant ML110 Gen9
Breedte:	195 mm
Diepte:	480.5 mm
Hoogte:	440 mm
Bluetooth:	Nee
Frequentie van processor:	1.6 GHz
Processorfamilie:	Intel® Xeon® E5 v3
Processormodel:	E5-2603V3
Aantal processorkernen:	6
Vormfactor:	4.5U
Ethernet LAN:	Ja
Geïntegreerde geheugenkaartlezer:	Ja
Compatibele geheugenkaarten:	MicroSD (TransFlash)
Processor lithografie:	22 nm
Aantal USB 2.0-poorten:	3
VGA (D-Sub)poort(en):	1
Aantal Ethernet LAN (RJ-45)-poorten:	2
Netvoeding:	350 W
Intern geheugen:	8 GB
Intern geheugentype:	DDR4-SDRAM
Bekabelingstechnologie:	10/100/1000Base-T(X)
Temperatuur bij opslag:	-30 - 65 °C
Intel® Wireless Display (Intel® WiDi):	Nee
Aantal poorten USB 3.2 Gen 1 (3.1 Gen 1) Type A:	5
Processor socket:	LGA 2011-v3
Stepping:	R2
Systeembus:	6.4 GT/s
Processor aantal threads:	6
PCI Express slots versie:	3.0
Processor operating modes:	64-bit
Processor cache:	15 MB
Bus type:	QPI
PCI Express configuraties:	x4, x8, x16
Thermal Design Power (TDP):	85 W
Codenaam processor:	Haswell
Maximaal aantal PCI Express-lijnen:	40
Processor cache type:	Smart Cache
ECC ondersteund door processor:	Ja
Processorfabrikant:	Intel
Maximum intern geheugen:	256 GB
Totale opslagcapaciteit:	0 GB
Soort optische drive:	Nee
Ondersteunde instructie sets:	AVX 2.0
Intel® My WiFi Technology (Intel® MWT):	Nee
Intel® Hyper Threading Technology (Intel® HT Technology):	Nee
Intel® Turbo Boost Technology:	Nee
Intel® Quick Sync Video Technology:	Nee
Intel® InTru™ 3D Technology:	Nee
Intel® Clear Video HD Technology (Intel® CVT HD):	Nee
Intel® Insider™:	Nee
Intel® Flex Memory Access:	Nee
Intel® AES New Instructions (Intel® AES-NI):	Ja
Enhanced Intel SpeedStep Technology:	Ja
Execute Disable Bit:	Ja
Idle States:	Ja
Thermal Monitoring Technologies:	Ja
CPU configuratie (max):	2
Intel® Enhanced Halt State:	Ja
Intel® Clear Video Technology for Mobile Internet Devices (Intel® CVT for MID):	Nee
Intel® VT-x with Extended Page Tables (EPT):	Ja
Ingebouwde opties beschikbaar:	Nee
Intel® Secure Key:	Ja
Intel® 64:	Ja
Intel® OS Guard:	Ja
Intel® Virtualization Technology for Directed I/O (VT-d):	Ja
Intel® Clear Video-technologie:	Nee
Intel® Virtualization Technology (VT-x):	Ja
Verpakkingsgrootte processor:	52.5 x 45 mm
Conflictvrije processor:	Nee
Intel® Identity Protection Technology (Intel® IPT):	Nee
Versie Intel® Identity Protection Technology:	0.00
Versie Intel® Secure Key Technology:	1.00
ARK ID processor:	83349
Intel® Trusted Execution Technology:	Ja
Intel® TSX-NI:	Nee
Versie Intel® TSX-NI:	0.00
Compatibele besturingssystemen:	Microsoft Windows Server\r\nCanonical Ubuntu\r\nRed Hat Enterprise Linux (RHEL)\r\nSUSE Linux Enterprise Server (SLES)\r\nVMware
Intel® Anti-Theft Technology (Intel® AT):	Nee
Luchtvochtigheid bij opslag:	0 - 95 procent
Type behuizing:	Tower
Maximaal intern geheugen ondersteund door processor:	768 GB
Geheugentypen ondersteund door processor:	DDR4-SDRAM
Klokgeheugen-snelheden ondersteund door processor:	1600 MHz
ECC:	Ja
Kloksnelheid geheugen:	2133 MHz
Geheugenslots:	8
SSD interfaces:	Serial Attached SCSI (SAS)
Ethernet interface type:	Gigabit Ethernet
Aantal geïnstalleerde processoren:	1
Geheugenbandbreedte ondersteund door de processor ( max):	51 GB/s
Chipset moederbord:	Intel C610
Schaalbaarheid:	2S
Hoogte, in bedrijf:	0 - 3048 m
Hoogte bij opslag:	0 - 9144 m
FSB Parity:	Nee
Front-side bus processor:	- MHz
Tcase:	72.8 °C
Intel® Demand Based Switching:	Ja
Physical Address Extension (PAE):	46 Bit
Geheugenkanalen ondersteund door processor:	Quad
Processorserie:	Intel Xeon E5-2600 v3
Intel® Dual Display Capable Technology:	Nee
Intel® FDI Technology:	Nee
Intel® Rapid Storage Technology:	Nee
Intel® Fast Memory Access:	Nee
RAID support:	Ja
PCI Express x16 (Gen 3.x) slots:	1
PCI Express x4 (Gen 3.x) slots:	2
HDD omvang:	- "
Maximale opslagcapaciteit:	- TB
Ondersteunde opslagstationinterfaces:	SAS, Serial ATA
Hot-plug ondersteuning:	Ja
Intel® Virtualization Technology (Intel® VT):	VT-d, VT-x
aantal QPI links:	2
PCI Express x8 (Gen 3.x) slots:	2
Aantal hoofdvoedingen:	1
Wake-on-LAN:	Ja
Compatibele processors:	Intel® Xeon®
Max. aantal SMP-processoren:	1
Wifi:	Nee
Bedrijfstemperatuur (T-T):	0 - 40 °C
Relatieve vochtigheid in bedrijf (V-V):	10 - 90 procent
Intel® Matrix Storage Technology (Intel® MST):	Nee
Prestatiebeheer:	HP iLO
Intel® On-Demand Power Redundancy Technology:	Nee
Intel® Local Control Panel:	Nee