HP ProLiant ML10 v2 Handleiding

HP Server ProLiant ML10 v2

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HP ProLiant ML10 Server

User Guide

Abstract

This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is in

tended for experienced

IT professionals or end users with no or prior hardware setup -

experience. HP assumes you are qualified in the servicing of computer equipment and

trained in recognizing hazards in products with hazardous energy levels.

Part Number: 730598- 003

December 2013

Edition: 3

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall

not be liable for technical or editorial errors or omissions contained herein.

Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.

Contents 3

Contents

Component identification ............................................................................................................... 6

F ront panel components ............................................................................................................................. 6

Front panel LEDs and buttons ...................................................................................................................... 6

Rear panel components .............................................................................................................................. 7

Rear panel LEDs and buttons ....................................................................................................................... 8

System board components .......................................................................................................................... 8

DIMM slot locations ......................................................................................................................... 9

System maintenance switch ............................................................................................................. 10

NMI functionality ........................................................................................................................... 10

Fan locations .......................................................................................................................................... 11

Operations ................................................................................................................................. 12

Power up the server ................................................................................................................................. 12

Power down the server ............................................................................................................................. 12

Remove the access panel.......................................................................................................................... 12

Remove the front bezel ............................................................................................................................. 13

Install the front bezel ................................................................................................................................ 14

Install the access panel............................................................................................................................. 14

Setup ......................................................................................................................................... 16

Optional installation services .................................................................................................................... 16

Optimum environment .............................................................................................................................. 16

Space and airflow requirements ...................................................................................................... 16

Temperature requirements ............................................................................................................... 17

Power requirements ....................................................................................................................... 17

Electrical grounding requirements .................................................................................................... 17

Identifying the contents of the server shipping carton .................................................................................... 18

Installing hardware options ....................................................................................................................... 18

Setting up a tower server .......................................................................................................................... 18

Powering up and configuring the server ..................................................................................................... 18

Installing the operating system................................................................................................................... 19

Registering the server ............................................................................................................................... 19

Hardware options installation ....................................................................................................... 20

Introduction ............................................................................................................................................ 20

HP product QuickSpecs ............................................................................................................................ 20

Drive installation guidelines ...................................................................................................................... 20

I nstalling the drive enablement option .............................................................................................. 20

Installing the 3 LFF drive enablement option ...................................................................................... 24

Optical drive option ................................................................................................................................ 32

Memory options ...................................................................................................................................... 36

DIMM identification ....................................................................................................................... 36

Single- -rank and dual rank DIMMs .................................................................................................... 37

Memory subsystem architecture ....................................................................................................... 37

Memory configuration .................................................................................................................... 37

Expansion board options .......................................................................................................................... 40

C abling ..................................................................................................................................... 43

Product specificaties

Merk:	HP
Categorie:	Server
Model:	ProLiant ML10 v2
Breedte:	175 mm
Diepte:	475.2 mm
Hoogte:	368.2 mm
Bluetooth:	Nee
Frequentie van processor:	3.1 GHz
Processorfamilie:	Intel® Xeon® E3 v3 familie
Processormodel:	E3-1220V3
Aantal processorkernen:	4
Grafische adapter:	G200
Ethernet LAN:	Ja
Processor lithografie:	22 nm
Aantal USB 2.0-poorten:	2
VGA (D-Sub)poort(en):	1
Aantal Ethernet LAN (RJ-45)-poorten:	2
Netvoeding:	350 W
Intern geheugen:	8 GB
Intern geheugentype:	DDR3-SDRAM
Bekabelingstechnologie:	10/100/1000Base-T(X)
Temperatuur bij opslag:	-30 - 65 °C
Intel® Wireless Display (Intel® WiDi):	Nee
Aantal poorten USB 3.2 Gen 1 (3.1 Gen 1) Type A:	2
Processor socket:	LGA 1150 (Socket H3)
Stepping:	C0
Systeembus:	5 GT/s
Processor aantal threads:	4
PCI Express slots versie:	3.0
Processor operating modes:	64-bit
Processor cache:	8 MB
Bus type:	DMI
PCI Express configuraties:	1x8, 1x16, 2x4, 2x8
Thermal Design Power (TDP):	80 W
Codenaam processor:	Haswell
Maximaal aantal PCI Express-lijnen:	16
Processor cache type:	Smart Cache
ECC ondersteund door processor:	Ja
Processorfabrikant:	Intel
Maximum intern geheugen:	32 GB
Totale opslagcapaciteit:	1000 GB
Ingebouwde grafische adapter:	Nee
On-board graphics adapter model:	Niet beschikbaar
Ondersteunde instructie sets:	AVX 2.0, SSE4.1, SSE4.2
Intel® My WiFi Technology (Intel® MWT):	Nee
Intel® Hyper Threading Technology (Intel® HT Technology):	Nee
Intel® Turbo Boost Technology:	2.0
Intel® Quick Sync Video Technology:	Nee
Intel® InTru™ 3D Technology:	Nee
Intel® Clear Video HD Technology (Intel® CVT HD):	Nee
Intel® Insider™:	Nee
Intel® Flex Memory Access:	Ja
Intel® AES New Instructions (Intel® AES-NI):	Ja
Enhanced Intel SpeedStep Technology:	Ja
Execute Disable Bit:	Ja
Idle States:	Ja
Thermal Monitoring Technologies:	Ja
CPU configuratie (max):	1
Intel® Enhanced Halt State:	Ja
Intel® Clear Video Technology for Mobile Internet Devices (Intel® CVT for MID):	Nee
Intel® VT-x with Extended Page Tables (EPT):	Ja
Ingebouwde opties beschikbaar:	Nee
Graphics & IMC lithografie:	22 nm
Intel® Secure Key:	Ja
Intel® 64:	Ja
Intel® OS Guard:	Ja
Intel® Virtualization Technology for Directed I/O (VT-d):	Ja
Intel® Clear Video-technologie:	Nee
Intel® Virtualization Technology (VT-x):	Ja
Verpakkingsgrootte processor:	37.5 x 37.5 mm
Conflictvrije processor:	Nee
Intel® Identity Protection Technology (Intel® IPT):	Ja
Versie Intel® Identity Protection Technology:	1.00
Versie Intel® Secure Key Technology:	1.00
ARK ID processor:	75052
Intel® Trusted Execution Technology:	Ja
Intel® TSX-NI:	Ja
Intel® Stable Image Platform Program (SIPP):	Ja
Versie Intel® Stable Image Platform Program (SIPP):	1.00
Versie Intel® TSX-NI:	1.00
Compatibele besturingssystemen:	Microsoft Windows Server\r\nCanonical Ubuntu\r\nRed Hat Enterprise Linux (RHEL)\r\nSUSE Linux Enterprise Server (SLES)\r\nVMware
Intel® Anti-Theft Technology (Intel® AT):	Ja
Luchtvochtigheid bij opslag:	0 - 95 procent
Maximale turbofrequentie van processor:	3.5 GHz
Type behuizing:	Tower (4U)
Maximaal intern geheugen ondersteund door processor:	32 GB
Geheugentypen ondersteund door processor:	DDR3-SDRAM
Klokgeheugen-snelheden ondersteund door processor:	1333,1600 MHz
ECC:	Ja
Kloksnelheid geheugen:	1600 MHz
Geheugenslots:	4x DIMM
SSD interfaces:	Serial Attached SCSI (SAS)
Ethernet interface type:	Gigabit Ethernet
Aantal geïnstalleerde processoren:	1
Geheugenbandbreedte ondersteund door de processor ( max):	25.6 GB/s
Chipset moederbord:	Intel® C222
Schaalbaarheid:	1S
Thermal solution specificatie:	PCG 2013D
Hoogte, in bedrijf:	0 - 3048 m
Hoogte bij opslag:	0 - 9144 m
Het aantal geïnstalleerde HDD's:	1
HDD capaciteit:	1000 GB
FSB Parity:	Nee
Front-side bus processor:	- MHz
Intel® Demand Based Switching:	Nee
Geheugenkanalen ondersteund door processor:	Dual
Processorserie:	Intel Xeon E3-1200 v3
Grafische adapter-familie:	Matrox
Intel® Dual Display Capable Technology:	Nee
Intel® FDI Technology:	Nee
Intel® Rapid Storage Technology:	Nee
Intel® Fast Memory Access:	Ja
RAID support:	Ja
PCI Express x16 (Gen 3.x) slots:	1
PCI Express x4 (Gen 3.x) slots:	1
HDD omvang:	3.5 "
Maximale opslagcapaciteit:	24 TB
Ondersteunde HDD-groottes:	3.5 "
Hot-plug ondersteuning:	Nee
Intel® Virtualization Technology (Intel® VT):	VT-d, VT-x
aantal QPI links:	1
PCI Express x8 (Gen 3.x) slots:	2
Aantal hoofdvoedingen:	1
Wake-on-LAN:	Ja
Compatibele processors:	Intel® Xeon®
Interne drive bays:	4
Max. aantal SMP-processoren:	1
Wifi:	Nee
Bedrijfstemperatuur (T-T):	0 - 40 °C
Relatieve vochtigheid in bedrijf (V-V):	10 - 90 procent
Intel® Matrix Storage Technology (Intel® MST):	Nee
Prestatiebeheer:	HP iLO
DVD interfacetype:	SATA
Intel® On-Demand Power Redundancy Technology:	Nee
Intel® Local Control Panel:	Nee
DVD:	Ja