Fujitsu Intel Xeon 5110 Handleiding

Fujitsu Processor Intel Xeon 5110

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Reference Number: 313355-003

Dual-Core Intel® Xeon®

Processor 5100 Series

Datasheet

August 2007

2 Dual-Core Intel® Xeon® Processor 5100 Series Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or

life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Dual-Core Intel® Xeon® Processor 5100 Series may contain design defects or errors known as errata which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

64-bit Intel® Xeon® processors with Intel® EM64T requires a computer system with a processor, chipset, BIOS, OS, device drivers

and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled

BIOS. Performance will vary depending on your hardware and software configurations. Intel EM64T-enabled OS, BIOS, device

drivers and applications may not be available. Check with your vendor for more information.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Intel Xeon, Intel SpeedStep, Intel Extended Memory 64 Technology, Intel Virtualization Technology, and the Intel

logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Dual-Core Intel® Xeon® Processor 5100 Series Datasheet 3

Contents

Features......................................................................................................................9

1 Introduction............................................................................................................... 11

1.1 Terminology ..................................................................................................... 12

1.2 State of Data.................................................................................................... 14

1.3 References ....................................................................................................... 14

2 Electrical Specifications ............................................................................................... 17

2.1 Front Side Bus and GTLREF ................................................................................ 17

2.2 Power and Ground Lands.................................................................................... 17

2.3 Decoupling Guidelines........................................................................................ 18

2.3.1 VCC Decoupling...................................................................................... 18

2.3.2 VTT Decoupling ...................................................................................... 18

2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 18

2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 18

2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 19

2.4.2 PLL Power Supply................................................................................... 20

2.5 Voltage Identification (VID) ................................................................................ 20

2.6 Reserved or Unused Signals................................................................................ 23

2.7 Front Side Bus Signal Groups.............................................................................. 24

2.8 CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 25

2.9 Test Access Port (TAP) Connection....................................................................... 25

2.10 Platform Environmental Control Interface (PECI) DC Specifications...........................26

2.10.1 DC Characteristics.................................................................................. 26

2.10.2 Input Device Hysteresis .......................................................................... 27

2.11 Mixing Processors.............................................................................................. 27

2.12 Absolute Maximum and Minimum Ratings ............................................................. 27

2.13 Processor DC Specifications ................................................................................ 29

2.13.1 VCC Overshoot Specification .................................................................... 35

2.13.2 Die Voltage Validation............................................................................. 36

3 Mechanical Specifications............................................................................................. 37

3.1 Package Mechanical Drawings ............................................................................. 37

3.2 Processor Component Keepout Zones................................................................... 41

3.3 Package Loading Specifications ........................................................................... 41

3.4 Package Handling Guidelines............................................................................... 42

3.5 Package Insertion Specifications.......................................................................... 42

3.6 Processor Mass Specifications ............................................................................. 42

3.7 Processor Materials............................................................................................ 43

3.8 Processor Land Coordinates ................................................................................ 43

4 Land Listing ............................................................................................................... 45

4.1 Dual-Core Intel® Xeon® Processor 5100 Series Pin Assignments............................. 45

4.1.1 Land Listing by Land Name...................................................................... 45

4.1.2 Land Listing by Land Number................................................................... 55

5 Signal Definitions ....................................................................................................... 65

5.1 Signal Definitions .............................................................................................. 65

6 Thermal Specifications ................................................................................................ 73

6.1 Package Thermal Specifications........................................................................... 73

6.1.1 Thermal Specifications ............................................................................ 73

6.1.2 Thermal Metrology ................................................................................. 81

6.2 Processor Thermal Features................................................................................82

6.2.1 Thermal Monitor Features........................................................................ 82

Product specificaties

Merk:	Fujitsu
Categorie:	Processor
Model:	Intel Xeon 5110
Maximale temperatuur (in bedrijf):	65 °C
Processorfamilie:	Intel® Xeon® 5000 reeks
Processormodel:	5110
Aantal processorkernen:	2
Processor lithografie:	65 nm
Processor socket:	LGA 771 (Socket J)
Processor operating modes:	64-bit
Processor cache:	4 MB
Thermal Design Power (TDP):	65 W
Processor cache type:	L2
CPU multiplier (bus/core ratio):	6
Front-side bus processor:	1066 MHz
Component voor:	Server/werkplaats
Systeemtype processor:	DP
Basisfrequentie processor:	1.6 GHz
VID Voltage Range:	1 - 1.5 V
Box:	Nee
L2-cache snelheid:	1.6 GHz
Marktsegment:	Server