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 2017-2021 Microchip Technology Inc.DS00002402D-page 1

INTRODUCTION

This application note provides information on design considerations for a printed circuit board (PCB) for the Microchip

CEC1702 device.

The design of the PCB requires care to provide good supply and ground paths; in addition, other design issues are

addressed in this document.

The functional blocks in the CEC1702 have different requirements for routing and external connections, which are also

outlined in this application note.

Please see References for device-level information such as V

CC1 power planes, and mechanical package information

for the 84-Pin WFBGA.

This document includes the following topics:

•Section 1.0, "General Layout Considerations," on page 2

•Section 2.0, "Miscellaneous Considerations," on page 9

•Section 3.0, "JTAG Design and Layout Guide," on page 19

Audience

This document is written for a reader that is familiar with hardware design. The goal of this application note is to provide

information about sensitive areas of the CEC1702 PCB layout.

References

The following documents should be referenced when using this application note. Please contact your Microchip repre-

sentative for availability.

•Microchip CEC1702 Data Sheet

•Microchip CEC1702 EVB Reference Schematic

• I2C-bus specification and user manual, Rev. 6 - 4 April, 2014 or later (see www.nxp.com/documents/user_manual/

UM10204.pdf)

Package Information

The CEC1702 device is currently available in the following package:

•CEC1702 for 84-pin, WFBGA

AN2402

PCB Layout Guide for CEC1702

Author:Tom Tse



Microchip Technology Inc.

Product specificaties